发明名称 |
METHOD OF REDUCING ABRASION OF DISK BY USING DITHERING PROCESS AND DISK DRIVE USING THE SAME |
摘要 |
Embodiments of the invention reduce abrasion of a disk via a dithering process that spreads a friction area between a magnetic head and the disk when a magnetic head lifts from the surface of the disk. In embodiments of the invention, the dithering process is executed only when the magnetic head is latched in a parking zone of the disk and when a disk spindle motor is in an acceleration mode.
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申请公布号 |
US2008225429(A1) |
申请公布日期 |
2008.09.18 |
申请号 |
US20080044173 |
申请日期 |
2008.03.07 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
OH KYOUNG-WHAN;LEE BONG-JIN |
分类号 |
G11B21/02 |
主分类号 |
G11B21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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