发明名称 METHOD OF REDUCING ABRASION OF DISK BY USING DITHERING PROCESS AND DISK DRIVE USING THE SAME
摘要 Embodiments of the invention reduce abrasion of a disk via a dithering process that spreads a friction area between a magnetic head and the disk when a magnetic head lifts from the surface of the disk. In embodiments of the invention, the dithering process is executed only when the magnetic head is latched in a parking zone of the disk and when a disk spindle motor is in an acceleration mode.
申请公布号 US2008225429(A1) 申请公布日期 2008.09.18
申请号 US20080044173 申请日期 2008.03.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 OH KYOUNG-WHAN;LEE BONG-JIN
分类号 G11B21/02 主分类号 G11B21/02
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