POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTING FILM, INSULATING FILM, SEMICONDUCTOR DEVICE OBTAINED USING THE SAME, AND DISPLAY

摘要

PROBLEM TO BE SOLVED: To provide a polyamide resin and a positive photosensitive resin composition that simultaneously satisfy high sensitivity and high resolution.

SOLUTION: The polyamide resin comprises a polyamide resin obtained by causing a bisaminophenol represented by general formula (1) to react with a carboxylic acid derivative with its terminal blocked by causing a compound, having an unsaturated aliphatic ring bearing a specific functional group reactive with an amine end of the polyamide resin, to react with a part of the amine terminals. In the formula, A is -CH2-, -C(CH3)2-, -O-, -C(CF3)2- or a single bond; R0and R1are the same or different and are each an organic group; and p and q are each an integer of 0-3.

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