| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting element storage package, excellent in reliability in its joint and inexpensive, which accurately flip-chip bonds the light emitting element and efficiently dissipates heat. <P>SOLUTION: The light emitting element storage package has, in the central part of an upper surface of an aluminum nitride multi-layered substrate 11, a connection pad 12 with a Cu film formed by an etching method for flip-chip bonding a light emitting element and a reflector 13 for surrounding the whole light emitting element to reflect light emitted, and in the outer periphery thereof, has an external connecting terminal 15 with a Cu film formed by the etching method to make an electrically conductive state with the external whilst being in a state electrically conductive with the connection pad 12, and plus, a heat plate 16 is installed by a clamping method such that it is in contact with the whole lower surface of the aluminum nitride multi-layered substrate 11, the heat plate 16 for dissipating heat from the light emitting element. <P>COPYRIGHT: (C)2008,JPO&INPIT |
