发明名称 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To achieve the image development of a photosensitive polyimide resin composition with a weakly alkaline aqueous solution, while keeping the solubility of the composition in a conventional organic solvent, even when a diamine component in the composition is partly replaced by a diaminopolysiloxane compound or a bis(aminobenzoate) compound, for the purpose of decreasing the elastic modulus of the composition to impart low warpage to the composition. <P>SOLUTION: A photosensitive polyimide resin composition comprises a polyimide resin comprising a polyimide unit of specific structure, a melamine cyanurate analogue and a diazonaphthoquinone analogue, which can be positive-tone developable with a weakly alkaline aqueous solution, and which is soluble in an organic solvent; and in the composition, the melamine cyanurate analogue is contained in an amount of 5-50 parts by weight, relative to 100 parts by weight of the polyimide resin. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008216984(A) 申请公布日期 2008.09.18
申请号 JP20080012879 申请日期 2008.01.23
申请人 SONY CHEMICAL & INFORMATION DEVICE CORP 发明人 NOMURA MAMIKO
分类号 G03F7/023;C08G73/10;G03F7/004;G03F7/022;G03F7/40 主分类号 G03F7/023
代理机构 代理人
主权项
地址