| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC fixing structure in which an IC can be surely positioned when fixing the IC that does not include a fixing portion, on an existent heat sink. SOLUTION: An IC fixing structure 40 is adopted to fix an IC 20 that does not comprise a through-hole for fixing, on a heat sink 30. The IC fixing structure 40 is constituted by simple processing applied to an IC fixing component 10 and the heat sink 30. The IC fixing component 10 is used to position the IC 20 without using a screw. Furthermore, the IC fixing component 10 positioning the IC 20 is screwed on the heat sink 30. The IC fixing component 10 surely positions the IC 20 and brings it into surface-contact with the heat sink 30, thereby improving workability when fixing the IC 20 on a substrate or the like. COPYRIGHT: (C)2008,JPO&INPIT |
