发明名称 COOLING DEVICE FOR ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a high performance cooling device for an electronic apparatus which can widen the range of a cooling object by constituting a heat receiving member capable of enhancing the thermal conversion efficiency of a cooling system inexpensively. SOLUTION: In the cooling device for the electronic apparatus, a heat receiving member is constituted to form an enclosed space for making a refrigerant flow internally by a base member thermally connected with a heating element and a case member. In a predetermined region on an opposing plane of the base member to be thermally connected with a heating element, a fin constituting a channel for making the refrigerant flow in the enclosed space is formed integrally and the base member in the region for forming a fin is made thinner than that in the other region not forming the fin. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008218589(A) 申请公布日期 2008.09.18
申请号 JP20070052169 申请日期 2007.03.02
申请人 HITACHI LTD 发明人 OIKAWA HIRONORI
分类号 H01L23/427;H01L23/36;H05K7/20 主分类号 H01L23/427
代理机构 代理人
主权项
地址