APPARATUS FOR TRANSFERRING A WAFER

摘要

A wafer transfer apparatus is provided to reduce relatively electrostatic force for absorbing a wafer by forming a plurality of pads on a blade. A ceramic blade(110) is formed to support a wafer(W). An electrode(120) is installed in the inside of the blade. The electrode is used for generating electrostatic force to absorb the wafer. A plurality of pads(130) are installed on an upper surface of the blade. The pads are used for forming friction with the wafer in order to suppress a flow of the wafer. A robot arm(140) is connected to the blade in order to move the blade. A gap between the pad and the electrode is greater than a gap between an upper surface of the electrode and the upper surface of the blade.