| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a bonding load and efficiently bond every electrode by a simple and convenient method while using a bonding device to bond electrodes of a semiconductor die and a circuit board. <P>SOLUTION: The bonding device 10 is used to bond electrodes of a semiconductor die 12 and a circuit board 19 by using a metal nano paste, and it is provided with: a bump formation mechanism 20 that injects micro liquid drops of the metal nano paste onto the electrode and forms bumps; a primary bonding mechanism 50 that presses down the bump of the semiconductor die 12 to that of the circuit board 19 and establishes primary bonding in non-conduction state of every electrode; and a secondary bonding mechanism 80 that pressurizes and heats each of primary bonded bumps in the bonding direction, pressurizes and sinters metal nano particles of each bump and establishes secondary bonding for conduction of every electrode. <P>COPYRIGHT: (C)2008,JPO&INPIT |
