ELECTRONIC CIRCUIT MOUNTING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an electronic circuit mounting structure capable of mounting a plurality of semiconductor elements in a very dense state.

SOLUTION: Bumps 12 are arranged zigzaging in three lines at the two side parts (the predetermined side parts) in a direction orthogonal to the longitudinal direction of the semiconductor element 11 out of the four side parts comprising the peripheral border of the main surface of the semiconductor element 11, and are arranged zigzaging in two lines at the facing two side parts (the other side part) in the longitudinal direction of the semiconductor elemenet 11. The protruding amount of a resin of a resin adhesive layer 16 from the side part with the small number of lines of the bump 12 is lareger than that of the side part with the large number of lines of the bump 12, and each of the semiconductor elements 11a to 11f is mounted in an arrangement with the predetermined side part having a small protruding amount of the resin of the resin adhesive layer 16 adjacent each other.

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