SEMICONDUCTOR DEVICE AND PLASMA DISPLAY DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a technique capable of improving heat radiation characteristics of a semiconductor device such as an address driver module. SOLUTION: A semiconductor chip 40 is disposed in an opening 51 of a flexible substrate 50. A bonding pad formed on the semiconductor chip 40 and a metal wiring formed on a flexible substrate 50 are connected by a wire 52. Then resin is provided for sealing to cover the semiconductor chip 40 and wire 52. A metal plate 54 is bonded to the surface of the flexible substrate 50 on the opposite side of the surface where the semiconductor chip 40 is mounted. One surface of the metal plate 54 is made uneven to increase the surface area of the metal plate 54. COPYRIGHT: (C)2008,JPO&INPIT