| 摘要 |
PROBLEM TO BE SOLVED: To provide a single-wafer etching device for a wafer capable of stabilizing the shape of the edge face of the wafer. SOLUTION: In the single-wafer etching device 10, the top face 11a and edge face 11b of the wafer 11 are etched by supplying the top face 11a of the wafer 11 with an etchant 15 while rotating the thin discoidal wafer 11 obtained by slicing a semiconductor ingot. A second nozzle 16 being opposed to the edge face 11b of the wafer 11 and supplying the edge face 11b of the wafer 11 with the etchant 15 is further fitted in addition to a first nozzle 14 supplying the top face 11a of the wafer 11 with the etchant 15. The second nozzle 16 is fixed and fitted at a specified place within a range of 0 to 20 mm in the wafer radial direction inside from the outer peripheral end of the wafer 11, and has an underside blow mechanism blowing off the etchant flowing down along the edge face of the wafer to the outside in the radial direction of the wafer by injecting a gas. COPYRIGHT: (C)2008,JPO&INPIT
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