| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and method for measuring a terminal planarity capable of accurately discriminating each terminal from a resin surface of a package other than the terminal and accurately measuring accurate degree of floating from a horizontal reference surface to the terminal even if IC chips, connectors, or the like where a plurality of terminals for connection are provided in the packaging surface of the package are measured. SOLUTION: The terminal planarity measuring device comprises: a glass substrate 24 for placing a pin 23 of a work 22 to be measured; a scanning means 32 for scanning a photosensor 25 along the glass substrate 24; a terminal position detection means 33 for detecting the position of each pin 23, based on a change in the quantity of reflection of laser beams applied to each pin 23 from the photosensor 25 by the scanning means 32; and a terminal height detection means 34 for measuring the degree of floating of each pin 23 from the surface of the glass substrate 24, based on the adjustment of the focus of laser beams applied to each pin 23. COPYRIGHT: (C)2008,JPO&INPIT
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