| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing heat transfer between semiconductor components. <P>SOLUTION: The semiconductor device 1 is equipped with a substrate 10, a semiconductor component 20 (a first semiconductor component), another semiconductor component 30 (a second semiconductor component), a heat dissipating plate 40 (a first heat dissipating plate) and another heat dissipating plate 50 (a second heat dissipating plate). The semiconductor components 20, 30 are mounted on the substrate 10. The maximum power consumption of the semiconductor component 30 is smaller than that of the semiconductor component 20. The heat dissipating plate 40 is fixed to the semiconductor component 20. The heat dissipating plate 50 is fixed to the semiconductor component 30. The heat dissipating plate 40 is estranged mutually from the heat dissipating plate 50. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
