| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste having an excellent bump suitability and which suppresses change of viscosity with time. SOLUTION: A curable conductive paste composition consists of an epoxy resin, a hardener, conductive powder and solvent. The epoxy resin consists of 5 to 35 weight% of a trifunctional or more polyfunctional epoxy resin having a softening point of 75°C or less, and 65 to 95 weight% of a bifunctional epoxy resin. In addition, a printed wiring board using the conductive paste composition is obtained. COPYRIGHT: (C)2008,JPO&INPIT
|
