| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board structure capable of strengthening a line so as to deal with a high frequency signal even if, for the line, a pattern width can not be formed wide in design. SOLUTION: The circuit board structure comprises a split substrate 60 separated from a work substrate W by forming a conductive thin film layer on a surface of the work substrate W to form the substrate and cutting the substrate from the work substrate W after substrate formation, and a slit SL formed through a substrate 40 from front side to rear side in a range where a branch GND 1 of the substrate 40 is formed. A terminal portion of the split substrate 60 is inserted into the slit SL, thereby fixing the split substrate 60 to the substrate 40. COPYRIGHT: (C)2008,JPO&INPIT
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