OXETHANE RESIN COMPOSITION

摘要

Disclosed is an oxethane resin composition which enables to obtain a cured product excellent in transparency, heat resistance, low water absorption property and low dielectric constant property. Also disclosed is a cured product obtained from such an oxethane resin composition. Specifically disclosed is an oxethane resin composition containing 10-88% by weight of an alicyclic oxethane resin (A), 10-88% by weight of an alicyclic epoxy resin (B) and 0.01-20 parts by weight of a thermal cationic polymerization initiator (C) per 100 parts by weight of the total of the alicyclic oxethane resin (A) and the alicyclic epoxy resin (B). The alicyclic oxethane resin (A) may be composed of 4,4'-bis[(3-ethyl-3-oxetanyl)methoxymethyl]bicyclohexyl, 1,4-bis[(3-ethyl-3-oxetanyl)methoxymethyl]cyclohexane, or a mixture of them. The alicyclic epoxy resin (B) may be composed of 3,4-epoxycyclohexylmethyl-3',4'- epoxycyclohexanecarboxylate.