<p>A method and apparatus are disclosed for securing a first metallic target object to a further metallic target object. The apparatus includes a heating element for heating a bonding interface region between juxtaposed portions of a first and further metallic target object, at least one chamber body portion securable around the interface region to form a chamber region surrounding the interface region, a pump member for at least partially removing oxygen from the chamber region and a target object locating unit arranged to locate portions of the first and further target objects in a juxtaposed position.</p>
