EXPOSURE EQUIPMENT, EXPOSURE METHOD, AND MANUFACTURING METHOD OF DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a highly precise exposure method by reducing the reaction force of actuation generated when a wafer stage or the like is actuated to make smaller the effect of vibration transmitted to an optical projection system or the like.

SOLUTION: In the exposure equipment for projecting the pattern of a reticle 1 on the wafer 3 through the optical projection system 2, the projection system 2 separated from a wafer base 7 mounted a wafer stage 5 is supported by flexible three rods 19A to 19C extending from a structure supporting a reticle stage 4 and a reticle base 9. The structure 6 is supported through a vibration resistant pad 49 on a floor having a wafer base 7 mounted thereon.

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