| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent an electrical defect caused by migration. <P>SOLUTION: A semiconductor device 10 includes a tape carrier 20 having an insulating thin film base material 20a and a plurality of leads 22, a semiconductor chip 30 which is mounted to the tape carrier and has a plurality of electrodes 32 connected to the leads, a sealing portion 40 which covers at least the side face and the reverse surface 30b of the semiconductor chip in one body, and a first water-repellent film 50a formed on the side of the reverse surface 20ab of the insulating thin film base material. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
