PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMING METHOD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND METHOD FOR REMOVING PHOTOCURED OBJECT

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having improved removability while retaining excellent resolution, a photosensitive element, a resist pattern forming method, a method for manufacturing a printed wiring board and a method for removing a photocured object.

SOLUTION: The photosensitive resin composition comprises (A) a compound having a conjugated diene moiety and a compound having a dienophilic moiety and (B) a photopolymerization initiator for initiating a photopolymerization reaction of a photoradical polymerizable compound, wherein one or both of (A) the compound having the conjugated diene moiety and the compound having the dienophilic moiety are a compound having a photoradical polymerizable ethylenically unsaturated bond within a molecule or a compound having a ring structure by the Diels-Alder reaction.

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