| 摘要 |
PROBLEM TO BE SOLVED: To provide a housing for cooling and an inverter device which is capable of housing and arranging electronic equipment compactly including transformers whose mounting heights are relatively high, and furthermore, capable of cooling the electronic equipment efficiently. SOLUTION: A housing (12) for cooling includes a housing outer frame (42) having apertures at upper and lower portions, a recessed first heating element housing chamber (51) arranged in a spacial area constituted of the housing outer frame (42) surrounded by a side wall (41) having apertures at upper and lower portions, and a cooling floor (40) arranged in the intermediate portion of the height direction of the housing outer frame (42) constituting a floor between the inner peripheral face (43) of the housing outer frame (42) and the outer peripheral face (44) of the side wall (41), and a continuous medium flow path (36) is formed in the cooling floor (40). COPYRIGHT: (C)2008,JPO&INPIT
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