| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component capable of improving solder finish even in a multilayer substrate. SOLUTION: The cross sectional areas of terminals are changed between the side of an electronic component element body 2 and the side of the distal end in a lead terminal part 3, so that the thermal conductivity of the electronic component element body 2 differs from that of a soldering part. Consequently, more heat is taken in by the soldering part than the electronic component element body 2. Even when heat is removed by the electronic component element body 2, the heat taken in by the soldering part exceeds the heat removed. Thus, molten solder is prevented from being dropped in temperature. COPYRIGHT: (C)2008,JPO&INPIT
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