| 摘要 |
PROBLEM TO BE SOLVED: To form a solder film having a satisfactory plane on the upper surface of a pattern portion used for contacting an electrode plate while using a lead-free solder in a process of flow-soldering an electronic component to a printed wiring board. SOLUTION: This manufacturing method of a printed wiring board 1 comprises a step of forming a plurality of slim corrugated pattern portions 6a connected to each other in forming a pattern portion 6 for connecting an electrode plate in a wiring pattern 5 in executing a pattern creating process. Thus, in a step of flow-soldering an electronic component on the printed wiring board 1, a solder film 8 having a satisfactory plane can be formed on the upper surface of the pattern portion 6 for contacting the electrode plate, i. e. the plurality of slim corrugated pattern portions 6a while using a lead-free solder. COPYRIGHT: (C)2008,JPO&INPIT
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