| 摘要 |
A high frequency package is provided with a high frequency device (2); a multilayer dielectric substrate (20) having the high frequency device (2) mounted on a surface layer; and a seal ring (3) and a cover (4), which are provided as electromagnetic shield members for covering a part of the surface layer of the multilayer dielectric substrate and the high frequency device (2). In the high frequency package, a leading end opened line (50) having a length of substantially 1/4 of the wavelength of a spurious wave is arranged on an inner conductor pad (5). Since spurious radiation propagating in a cavity space is coupled to the wire and radiated to the external through a bias line on a layer in the multilayer dielectric substrate, a coupling quantity to the wire can be reduced and a spurious radiation quantity to the external can be reduced. |
