发明名称 HEAT TREATMENT APPARATUS, HEAT TREATMENT METHOD, AND COMPOUND MACHINE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment apparatus and a heat treatment method by which the whole of or a part of workpiece to be worked can be heated, and to provide a compound machine using the apparatus. SOLUTION: The heat treatment apparatus has: a furnace surrounding the workpiece to be worked; and a locally heating unit, which is arranged in the inner part of the furnace and locally heats the workpiece. The heat treatment apparatus is configured so that the heating furnace or a heat-insulating furnace is compounded with the locally heating unit using laser beams, thereby shortening a heating time, and also obtaining the compact apparatus capable performing various kinds of heat treatment such as quenching, tempering, normalizing and annealing. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008214750(A) 申请公布日期 2008.09.18
申请号 JP20080023703 申请日期 2008.02.04
申请人 JTEKT CORP 发明人 NAGAHAMA TAKAYA;NISHI KOJI
分类号 C21D1/09;C21D1/34 主分类号 C21D1/09
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