| 摘要 |
PROBLEM TO BE SOLVED: To provide an inorganic material component capable of having a cured product which shows a low thermal expansion and an excellent processability and is excellent in filling property in the state of a filler. SOLUTION: The component (100a) is the inorganic material component (100a) comprising an inorganic material substrate (LTCC substrate etc. 200) having void parts (210) which are through-holes and/or recesses and a cured product (300) obtained by filling the filler in at least one of the void parts (through-holes etc. 210) 210 and curing the same. The filler comprises a liquid epoxy resin (bisphenol and aminophenol etc.), a hardener, a compatibilizer (silicone oil etc.), an inorganic filler (silica etc.) and an organic filler (silicone rubber), provided that the inorganic filler has a particle size distribution wherein the difference between D10 and D50 is≥9μm. Alignment holes (310) can be formed on some parts of the cured product (300). COPYRIGHT: (C)2008,JPO&INPIT
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