发明名称 |
Article and Panel Comprising Semiconductor Chips, Casting Mold and Methods of Producing the Same |
摘要 |
A panel with a reconfigured wafer including semiconductor chips arranged in rows and columns on semiconductor device positions includes: at least one semiconductor chip having a front, a rear and edge sides provided per semiconductor device position. The reconfigured wafer includes: a front side that forms a coplanar area with the front sides of the at least one semiconductor chip and a plastic housing composition embedding the edge sides and the rear side of the at least one semiconductor chip. The reconfigured wafer includes, on a rear side of the wafer, structures configured to stabilize the panel. The structures are composed of the plastic housing composition and are formed as thickenings of the reconfigured wafer.
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申请公布号 |
US2008224296(A1) |
申请公布日期 |
2008.09.18 |
申请号 |
US20080047016 |
申请日期 |
2008.03.12 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
MEYER THORSTEN;BRUNNBAUER MARKUS |
分类号 |
H01L23/31;B29C39/02;H01L21/56;H01L23/48 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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