| 发明名称 |
BGA PACKAGE SUBSTRATE AND METHOD OF FABRICATING SAME |
| 摘要 |
Disclosed is a ball grid array (BGA) package substrate, in which a wire bonding pad and a solder ball pad are formed on a via hole, making high freedom in design of a circuit pattern and a high density circuit pattern possible, and a method of fabricating the same.
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| 申请公布号 |
US2008223610(A1) |
申请公布日期 |
2008.09.18 |
| 申请号 |
US20080116679 |
申请日期 |
2008.05.07 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHOI JAE MIN;SHIN YOUNG HWAN |
| 分类号 |
H01R12/04 |
主分类号 |
H01R12/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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