发明名称 ELECTRONIC DEVICE, AND ELECTRONIC DEVICE MANUFACTURING METHOD
摘要 Intended is to make it possible to fill clearances between electronic parts and a wiring board, in case they are narrow, conveniently and effectively with a reinforcing resin. Provided is an electronic device, in which a plurality of electrode pads of electric parts and a plurality of pads of a wiring board are electrically connected through electric conductors and in which the clearances between the electronic parts and the wiring board are filled with a resin. Between the conductors adjoining each other, and in the connecting face of at least one of the wiring board and the electronic parts, grooves are formed from the central portion to the outer peripheral portion and is filled with the resin.
申请公布号 WO2008111345(A1) 申请公布日期 2008.09.18
申请号 WO2008JP52136 申请日期 2008.02.08
申请人 NEC CORPORATION;ABE, KATSUMI 发明人 ABE, KATSUMI
分类号 H05K3/28;H01L23/28;H05K3/34 主分类号 H05K3/28
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