| 摘要 |
PROBLEM TO BE SOLVED: To efficiently obtain individual chips having a target thickness from wafers wherein chips have different target thicknesses. SOLUTION: The mapping data as to the target thickness of the chip 3 is acquired by inspecting each chip 3 of the wafer 1. Next, recessing or cutting processing exceeding the maximum thickness of the chip 3 is carried out along the cutting schedule line 2, and then after sticking the protective tape 5 on the surface thereof, the wafer 1 is held on the chuck table 17 of a grinding processing apparatus 10 with the backside thereof being exposed. Next, the wafer 1 is reduced to the first target thickness by carrying out the backside grinding thereof, and then the chip 3 having the first target thickness is picked up by a pickup apparatus 40 based on the mapping data. Successively, a process for reducing the wafer 1 to the target thickness by backside grinding and a process for picking up the chip 3 with the target thickness are repeated to obtain the individual chips 3 by thickness. COPYRIGHT: (C)2008,JPO&INPIT
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