| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method and a mounting device for obtaining a mounting board of excellent quality while enhancing the cycle time. SOLUTION: A method for mounting chips [C] at total N predetermined mounting positions [P(1)-P(N)] on a substrate [K] assuming k is an integer of 1 or above and n is an integer satisfying a relation N>=n>k includes an operation for dispensing adhesive to the predetermined mounting positions [P(1)-P(N)], and an operation for bonding the chips [C] to the predetermined mounting positions [P(1)-P(N)]. Bonding operation to the (n-k)th predetermined mounting position [P(n-k)] is performed in parallel with the dispensing operation to the n-th predetermined mounting position [P(n)]. COPYRIGHT: (C)2008,JPO&INPIT
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