WIRING CONDUCTOR, MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a Pb-free wiring conductor with less risk of generation of whiskers from an Sn-plated film surface or a solder of a conductor periphery, even in an environment with large external stress applied such as a fitted part with a connector and with no increase of contact resistance even in a high temperature and high humidity environment, and to provide its manufacturing method. SOLUTION: The wiring conductor is a composite formed of a Pb-free Sn-based material part 31 and metallic material as a core member 33 at least on a part of its surface and is provided with an Ni-P intermediate layer 32 of a predetermined thickness between the core material 33 and the Sn-based material part 31. The Ni-P intermediate layer 32 is dispersed in the Sn-based material part 31 through reflowing, the Ni-P intermediate layer 32 disappears, and a composite membrane 35 formed of Sn oxide and P oxide (or a composite membrane formed of Sn oxide and a phosphate compound) is formed on a surface of the Sn-based material part 31. COPYRIGHT: (C)2008,JPO&INPIT