| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper conductive paste capable of obtaining a high adherence power without performing environmental control on calcining, and forming a copper conductive film with an excellent resistivity to plating. SOLUTION: A first and a second glass frits of borosilica-acidic zinc are contained as a glass frit for the copper conductive paste. The first glass frit has (1) a softening point below 700°C and a contact angle below 60°to a film made of copper powder; (2) contents of 3 to 10 mass% SiO<SB>2</SB>, 25 to 35 mass% of B<SB>2</SB>O<SB>3</SB>, 50 to 65 mass% ZnO, 0 to 5 mass% Al<SB>2</SB>O<SB>3</SB>, and 1 to 5 mass% Na<SB>2</SB>O+Li<SB>2</SB>O+K<SB>2</SB>O. The second glass frit has (3) a softening point below 700°C and a solubility below 1 mg/cm<SP>2</SP>×hr; and (4) contents of 30 to 45 mass% SiO<SB>2</SB>, 7 to 15 mass% B<SB>2</SB>O<SB>3</SB>, 20 to 30 mass% ZnO, 0 to 5 mass% CaO, 0 to 5 mass% Al<SB>2</SB>O<SB>3</SB>, 0 to 5 mass% TiO<SB>2</SB>, 3 to 10 mass% ZrO<SB>2</SB>, and 8 to 15 mass% Na<SB>2</SB>O+Li<SB>2</SB>O+K<SB>2</SB>O. COPYRIGHT: (C)2008,JPO&INPIT
|
