FINE PITCH MICROCONTACTS AND METHOD FOR FORMING THEREOF

摘要

A method includes applying a final etch-resistant material 34 to an in-process substrate 10 so that the final etch-resistant material 34 at least partially covers first microcontact portions 32 integral with the substrate 10 and projecting upwardly from a surface 18 of the substrate, and etching the surface of the substrate 10 so as to leave second microcontact portions 36 below the first microcontact portions 32 and integral therewith, the final etch-resistant material 34 at least partially protecting the first microcontact portions 32 from etching during the further etching step. A microelectronic unit includes a substrate 10, and a plurality of microcontacts 38 projecting in a vertical direction from the substrate 10, each microcontact 38 including a base region 42 adjacent the substrate and a tip region 32 remote from the substrate, each microcontact 38 having a horizontal dimension which is a first function of vertical location in the base region 42 and which is a second function of vertical location in the tip region 32.