| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a circuit board which can be manufactured in a simpler process and has a further microfabricated circuit pattern. <P>SOLUTION: A mold 10 having a convex portion 11, corresponding to a circuit pattern on its surface, is used to give a conductive material layer (metal paste) 13 to the tip of the convex portion 11 of the mold 10. The conductive material layer is heated and pressure welded onto the surface of a substrate 20 as, e.g. a resin film. By doing this, the conductive material layer (metal paste) 13 is transferred to the substrate 20, together with the shape of the convex portion 11. The resin substrate (resin molded product 30) after transfer is immersed into a plating bath, e.g. a sulphuric acid copper plating bath to execute electrolytic plating processing. The copper ions in the plating bath precipitate in a concave portion 31 transferred by using the transferred conductive material layer 13 as a base material, and a metal wiring 32 is formed. Since the concave portion 31 to be transferred to the base material 20 is dependent on the shape of the convex portion 11 of the mold 10, high density and fine circuit pattern, consisting of the metal wiring 32 of an arbitrary aspect ratio, can be formed. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
