| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package and en electronic component that can prevent cracks in solder bumps and thereby preventing destruction of the solder bumps and impaired transmission of signals. SOLUTION: A solder bump 21 is disposed in an opening 18 formed in a second insulation film 15. The solder bump 21 is made of solder formed in a substantially spherical shape, and is electrically connected to a redistribution layer 14 in the opening 18. The surface of the solder bump 21 is coated with a bump coating portion 22. The bump-coating portion 22 coats at least part of the surface of the solder bump 21, and is made of a conductive material having a melting point lower than that of a member which constitutes the solder bump 21. COPYRIGHT: (C)2008,JPO&INPIT
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