发明名称 INSPECTION DEVICE AND INSPECTION METHOD
摘要 PROBLEM TO BE SOLVED: To provide an inspection device capable of inspecting accurately a wiring pattern formed on a circuit board. SOLUTION: This inspection device 11 capable of inspecting the wiring pattern 3 for connecting a bump 1 formed on the circuit board 5 to an external connection terminal 2 is equipped with a charging device 12 for charging the bump 1; a discharge gap 16 connected to the external connection terminal 2, for discharging the charge charged in the bump 1 via the wiring pattern 3; and a processing part 19 for measuring a discharge current I1 flowing in the wiring pattern 3 by discharging, and inspecting the wiring pattern 3 based on the discharge current I1 measured. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008215899(A) 申请公布日期 2008.09.18
申请号 JP20070050943 申请日期 2007.03.01
申请人 HIOKI EE CORP 发明人 IMAIZUMI KEN
分类号 G01R31/02;G01R31/302;H05K3/00 主分类号 G01R31/02
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