PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART

摘要

A photosensitive resin composition that gives a hardened film whose properties are by no means inferior to those of film hardened at high temperature; a process for producing a patterned hardened film with the use of the resin composition; and electronic parts. The photosensitive resin composition comprises (a) polybenzoxazole precursor having any of repeating units of the general formula: [chemical formula 1] (I) (wherein U and V are bivalent organic groups, provided that at least one of U and V is a group containing a C₁-C₃₀ aliphatic chain structure), (b) photosensitive agent, (c) solvent and (d) crosslinking agent capable of crosslinking or polymerization when heated.