| 摘要 |
One embodiment of the present invention is an apparatus useful to control temperature of a device that includes: (a) a heat transfer apparatus; (b) a combined path to the heat transfer apparatus; (c) a first path maintained at a first temperature and connected to the combined path; (d) a second path maintained at a second temperature and connected to the combined path; (e) a third path connected to the combined path; (f) a pump assembly operable to circulate thermal transfer fluid: (i) from the heat transfer apparatus, (ii) through one or more of the first, second and third paths, (iii) from the one or more of the first, second and third paths, through the combined path, and (iv) from the combined path, to and through the heat transfer apparatus; and (g) a valve assembly operable to cause predetermined amounts of thermal transfer fluid to flow into one or more of the first, second, and third paths, thereby controlling the temperature.
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