| 摘要 |
The invention relates to a method for making integrated circuits in gener al, in particular image sensing circuits intended to form the electronic cor e of cameras or photographic devices. It is sometimes desirable to precisely position the chip of an image sensor (12) relative to the optical axis of t he camera. In order to do so, the chip is first aligned relative to the hous ing (10), then the housing is aligned relative to the optical system. The al ignment of the chip relative to housing is carried out optically. The alignm ent of the housing relative to the system is carried mechanically based on t he edges of the housing. According to the invention, optical marks (30) are provided on the housing, each mark having an edge aligned with a side edge o f the housing in order to minimise the positioning errors that may occur due to an inaccurate positioning of the chip relative to the edges of the housi ng. |
