| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method for accurately judging the quality of a wafer. SOLUTION: The inspection method is constituted so as to inspect the wafer on the way of a processing process and has an analyzing process (step S101) for analyzing the material of foreign matter in the vicinity of the peripheral edge part of the wafer and a judging process (step S102) for judging whether the foreign matter exerts an effect on the processing process on and after the analyzing process. COPYRIGHT: (C)2008,JPO&INPIT
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