发明名称 Programmable Vias for Structured ASICs
摘要 A semiconductor device may be created using multiple metal layers and a layer including programmable vias that may be used to form various patterns of interconnections among segments of metal layers. The programmable vias may be formed of materials whose resistance is changeable between a high-resistance state and a low-resistance state.
申请公布号 US2008224260(A1) 申请公布日期 2008.09.18
申请号 US20080046626 申请日期 2008.03.12
申请人 EASIC CORPORATION 发明人 SCHMIT HERMAN;VASISHTA RONNIE;LEVINTHAL ADAM;PARK JONATHAN
分类号 H01L23/525;H01L21/768 主分类号 H01L23/525
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