| 摘要 |
According to an aspect of an embodiment, an electronic device comprises a bonding material, an electronic component providing a plurality of pads on a bottom surface thereof, and a printed circuit board providing a plurality of pads on a surface thereof, at least one of the pads of the printed circuit board being connected to at least one of the pads of the electronic component by the bonding material so as to connect the printed circuit board with the electronic component electrically, wherein either the electronic component or the printed circuit board provides a dummy pad on which the bonding material is formed, the bonding material on the dummy pad butting against the other of the surfaces of the electronic component or the printed circuit board.
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