发明名称 Capacitor embedded printed circuit board
摘要 A capacitor embedded printed circuit board (PCB), the PCB including: a multilayer polymer capacitor layer where a plurality of polymer sheets is laminated; one or more first inner electrodes and second inner electrodes, separated by one or more of the plurality of polymer sheets and alternately disposed to form a pair; a plurality of first extended electrodes and second extended electrodes connected to the first inner electrodes and second inner electrodes, respectively; one or more insulating layers laminated on one or both surfaces of the multilayer polymer capacitor, where a plurality of conductive patterns and conductive via holes, forming an interlayer circuit are formed; a plurality of first via holes for capacitor, penetrating the multilayer polymer capacitor layer to be connected to the first extended electrodes; and a plurality of second via holes for capacitor, penetrating the multilayer polymer capacitor layer to be connected to the second extended electrodes, wherein the plurality of the first and second extended electrodes are alternately disposed to be opposite to each other.
申请公布号 US2008223603(A1) 申请公布日期 2008.09.18
申请号 US20080068790 申请日期 2008.02.12
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM JIN CHEOL;KIM TAE KYOUNG;OH JUN ROK
分类号 H05K1/16 主分类号 H05K1/16
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