| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a means capable of easily repairing and treating an electronic part under a mounted state. <P>SOLUTION: The means has a part body 101a for the BGA type electronic part 101 having an external shape in a rectangular tabular shape and incorporating circuit chips on its inside, and bumps 101b electrically connecting the circuit chips to wirings on the outside of the part. The means further has a wiring board 102 fitting the wirings on at least its surface, loading the part body 101a and electrically connecting the circuit chips in the part body 101a at land terminals 102a for the wirings by the bumps 101b and an adhesive 105 fixing the part body 101a to the wiring board 102 by an adhesion limited to the edges of the part body 101a. <P>COPYRIGHT: (C)2008,JPO&INPIT |
