| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-quality transfer molding die, capable of manufacturing the package of an optical semiconductor having no voids or unfilled portions. SOLUTION: The transfer molding die is used for manufacturing the package of the optical semiconductor, with at least a recess 5' for mounting the optical semiconductor. The mold has a first metal mold 1 with a protrusion 6 for forming the recess 5', and a second metal mold 2 opposing the protrusion 6 of the first metal mold 1, and an air vent 3 is provided in the second mold 2 at a position opposing the protrusion 6. COPYRIGHT: (C)2008,JPO&INPIT
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