| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a base for mounting an electronic component which prevents generation of whisker in a plating layer formed on a wiring pattern formed of a metallic foil. SOLUTION: The method has: a film formation step for forming a plated layer 22a in each surface of a wiring pattern core body 2a provided in parallel on a resin film 1; a reformulation step for reforming the plated layer 22a while holding the plated layer 22a in a temperature region wherein an increase of inner stress in the plated layer 22a lessens when compared with that held at a normal temperature immediately after its formation; and a solder resist formation step for forming a solder resist 3 to cover a part of the plated layer 22a which is subjected to reformulation. COPYRIGHT: (C)2008,JPO&INPIT
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