发明名称 HEAT CONDUCTOR AND HEAT RADIATION STRUCTURE FOR HEATING COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a fully versatile heat conductor in a simple configuration for transmitting the heat of a heating component to a case body and radiating it to the outside, and a heat radiation structure for heating component. SOLUTION: The heat conductor 1 comprises: a roughly disk-like planar part 1b provided with an attaching hole 1a on the center; and a rectangular tongue-like part 1d disposed in a double ring shape around the attaching hole 1a at the peripheral edge part of the planar part 1b and the almost middle part of the peripheral edge part and the attaching hole 1a and formed by being cut and erected elastically deformably in a convex curve shape from the planar part 1b such that a peak part 1c is turned to the outer part in the radial direction. Then, the heat conductor 1 is screwed through the attaching hole 1a to the inner wall surface of a case body B, the tongue-like part 1d erected from the planar part 1b is brought into press contact with and abutted to the surface of the heating component such as a hard disk drive A. The heat radiation structure for heating component in which a heat conductive path from the heating component to the case body B is formed is constructed. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008218847(A) 申请公布日期 2008.09.18
申请号 JP20070056454 申请日期 2007.03.06
申请人 RICOH CO LTD 发明人 YOMOGIDA MATSUO
分类号 H05K7/20;G11B33/14 主分类号 H05K7/20
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