| 摘要 |
PROBLEM TO BE SOLVED: To provide a material having excellent moldability, excellent flame retardancy, a low water absorptivity, and a low coefficient of linear thermal expansion, all of which are requisite for an electronic material. SOLUTION: The material is a polyphenylene ether resin composition comprising (a) 45-95 pts.wt. polyphenylene ether resin, (b) 5-55 pts.wt. polyphenylene sulfide resin, and (c) 0.1-30 pts.wt. cage silsesquioxane compound. A molding comprising the resin composition and a film comprising the same are provided by melt molding. COPYRIGHT: (C)2008,JPO&INPIT
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