发明名称 |
Ceramic Substrate and Method for Manufacturing the Same |
摘要 |
A chip-mounted substrate includes a chip electronic component on a ceramic substrate having surface electrodes. The chip electronic component includes a ceramic sintered compact defining an element assembly and terminal electrodes. The surface electrodes of the ceramic substrate are integrated with the corresponding external terminal electrodes by sintering.
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申请公布号 |
US2008223606(A1) |
申请公布日期 |
2008.09.18 |
申请号 |
US20060596312 |
申请日期 |
2006.06.08 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
TSUKIZAWA TAKAYUKI;IKEDA TETSUYA;CHIKAGAWA OSAMU |
分类号 |
H05K1/16;H05K3/30 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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